Technical parameters/RAM size: 24 KB
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 252
Encapsulation parameters/Encapsulation: BGA-252
External dimensions/packaging: BGA-252
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Motorola | 功能相似 | BGA |
DSP Fixed-Point 24Bit 100MHz 100MIPS 252Pin MA-BGA Tray
|
||
DSP56301VF100
|
NXP | 功能相似 | BGA-252 |
DSP Fixed-Point 24Bit 100MHz 100MIPS 252Pin MA-BGA Tray
|
||
|
|
Motorola | 功能相似 | BGA |
IC DSP 24Bit 80MHz 252-BGA
|
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