Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MSOP
External dimensions/packaging: MSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY10EP11UKC
|
Micrel | 功能相似 | TSSOP-8 |
IC CLK BUFFER 1:2 3GHz 8MSOP
|
||
SY10EP11UKG
|
Micrel | 功能相似 | MSOP-8 |
SY10EP11U 系列 3 GHz 1:2 差分PECL/LVPECL/ECL 扇出缓冲器 - MSOP-8
|
||
SY10EP11UKG
|
Microchip | 功能相似 | MSOP-8 |
SY10EP11U 系列 3 GHz 1:2 差分PECL/LVPECL/ECL 扇出缓冲器 - MSOP-8
|
||
SY10EP11UKI
|
Micrel | 功能相似 | MSOP |
IC CLK BUFFER 1:2 3GHz 8MSOP
|
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