Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY10EP33VZI
|
Microchip | 功能相似 | SOIC-8 |
IC DIVIDER /4 5V/3.3V 8-SOIC
|
||
|
|
Micrel | 功能相似 | SOIC |
5V/3.3V 4GHz, ± 4 PECL/LVPECL DIVIDER
|
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