Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Thaler | 类似代替 |
IC VREF SERIES 2.5V 8SMT
|
|||
VRE3025AS
|
Apex Microtechnology | 类似代替 | SMD-8 |
IC VREF SERIES 2.5V 8SMT
|
||
VRE3025JS
|
Apex Microtechnology | 类似代替 | SMD-8 |
Ic Vref Series 2.5V 8smt
|
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