Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
VRE310JD
|
Thaler | 功能相似 |
Ic Vref Series 10V 8dip
|
|||
VRE310JD
|
Apex Microtechnology | 功能相似 | DIP-8 |
Ic Vref Series 10V 8dip
|
||
VRE310JD
|
Cirrus Logic | 功能相似 | DIP |
Ic Vref Series 10V 8dip
|
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