Chip AI consultant
Package parameters/number of pins: 1072
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/EU RoHS: Not Compliant
Other/Part Status: Obsolete
Other/Pin Count: 1072
Other/Supplier Package: HFCBGA
Other/Standard Package Name: BGA
Other/Counting: Surface Mount
Other/Package Length: 45
Other/Package Width: 45
Other/PCB changed: 1072
Compliant with standards/RoHS standards: Non-Compliant
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