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Model VS-HFA25TB60SPBF
Description HEXFRED® Ultra fast recovery rectifier, Vishay Semiconductor Vishay HEXFRED ® The series of products is an ultra fast recovery rectifier, which includes ultra fast planar technology and an internal structure based on patented Schottky barriers, and can perform soft and fast recovery operations under any dif/dt conditions. These features mean HEXFRED ® The product is very suitable for use as a matching micro diode for IGBT and MOSFET. ###Features: Ultra fast recovery time, ultra soft recovery, extremely low IRRM, extremely low Qrr, reduced radio frequency interference (RFI) and electromagnetic interference (EMI), reduced power consumption in diodes and switching transistors, shock absorption, diodes and rectifiers, Vishay Semiconductor
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Brand: VISHAY
Packaging TO-263-3
Delivery time
Packaging method Tube
Standard packaging quantity 1
23.37  yuan 23.37yuan
5+:
$ 27.3382
50+:
$ 26.1699
200+:
$ 25.5157
500+:
$ 25.3521
1000+:
$ 25.1885
2500+:
$ 25.0016
5000+:
$ 24.8848
7500+:
$ 24.7680
Quantity
5+
50+
200+
500+
1000+
Price
$27.3382
$26.1699
$25.5157
$25.3521
$25.1885
Price $ 27.3382 $ 26.1699 $ 25.5157 $ 25.3521 $ 25.1885
Start batch production 5+ 50+ 200+ 500+ 1000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(5332) Minimum order quantity(5)
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Technical parameters/forward voltage: 2 V

Technical parameters/reverse recovery time: 75 ns

Technical parameters/Maximum reverse voltage (Vrrm): 600 V

Technical parameters/forward current: 25000 mA

Technical parameters/Maximum forward surge current (Ifsm): 225 A

Technical parameters/maximum reverse leakage current (Ir): 1.5 uA

Technical parameters/forward voltage (Max): 1.7V @25A

Technical parameters/forward current (Max): 25 A

Technical parameters/operating temperature (Max): 150 ℃

Technical parameters/operating temperature (Min): -55 ℃

Technical parameters/dissipated power (Max): 125000 mW

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 3

Encapsulation parameters/Encapsulation: TO-263-3

External dimensions/length: 10.67 mm

External dimensions/width: 9.65 mm

External dimensions/height: 4.83 mm

External dimensions/packaging: TO-263-3

Other/Packaging Methods: Tube

Compliant with standards/RoHS standards:

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