Technical parameters/reverse recovery time: 60 ns
Technical parameters/forward current: 15 A
Technical parameters/Maximum forward surge current (Ifsm): 150 A
Technical parameters/forward voltage (Max): 2 V
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/working junction temperature (Max): 150 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-247
External dimensions/packaging: TO-247
Physical parameters/operating temperature: -55℃ ~ 150℃
Other/Packaging Methods: Each
Compliant with standard/REACH SVHC version: 2014/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HFA30PA60C
|
VISHAY | 类似代替 | TO-247-3 |
超快软恢复二极管， 2× 15 A Ultrafast Soft Recovery Diode, 2 x 15 A
|
||
HFA30PA60C
|
International Rectifier | 类似代替 | TO-247 |
超快软恢复二极管， 2× 15 A Ultrafast Soft Recovery Diode, 2 x 15 A
|
||
HFA30PA60CPBF
|
Vishay Semiconductor | 类似代替 | TO-247-3 |
超快软恢复二极管， 2× 15 A Ultrafast Soft Recovery Diode, 2 x 15 A
|
||
|
|
Vishay Intertechnology | 类似代替 | TO-247 |
超快软恢复二极管， 2× 15 A Ultrafast Soft Recovery Diode, 2 x 15 A
|
||
|
|
LiteOn | 类似代替 | TO-247 |
超快软恢复二极管， 2× 15 A Ultrafast Soft Recovery Diode, 2 x 15 A
|
||
HFA30PA60CPBF
|
VISHAY | 类似代替 | TO-247 |
超快软恢复二极管， 2× 15 A Ultrafast Soft Recovery Diode, 2 x 15 A
|
||
VS-HFA30PA60C-N3
|
VISHAY | 类似代替 | TO-247 |
HEXFRED® 超快恢复整流器，Vishay Semiconductor Vishay HEXFRED® 系列产品是超快速恢复整流器，包含超快平面技术和基于专利肖特基挡板的内部结构，可在任何 diF/dt 条件下进行软和快速恢复操作。 这些特性意味着 HEXFRED® 产品非常适合用作用于 IGBT 和 MOSFET 的配套微二极管。 ### 特点 超快恢复时间 超软恢复 极低 IRRM 极低 Qrr 减少射频干扰 (RFI) 和电磁干扰 (EMI) 降低二极管和开关晶体管中的功耗 减少减震 ### 二极管和整流器，Vishay Semiconductor
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