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Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Part Status: NRND
Other/Supplier Package: WLCSP
Other/Standard Package Name: BGA
Other/Pin Count: 8
Other/Counting: Surface Mount
Other/Package Height: 0.31
Other/Package Length: 2.71
Other/Package Width: 1.76
Other/PCB changed: 8
Other/Lead Shape: Ball
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