Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
先科ST | 功能相似 | 8脚 |
PROM 串行 Microwire,STMicroelectronics 工业标准 MICROWIRE™ 总线 ### EEPROM 串行存取 - STMicroelectronics
|
||
M93C46-WDW6TP
|
ST Microelectronics | 功能相似 | TSSOP-8 |
PROM 串行 Microwire,STMicroelectronics 工业标准 MICROWIRE™ 总线 ### EEPROM 串行存取 - STMicroelectronics
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review