Technical parameters/power supply voltage (DC): 3.30 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 10
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY55857LKG
|
Micrel | 完全替代 | TFSOP-10 |
PECL 逻辑,Microchip ### PECL 逻辑
|
||
SY55857LKI
|
Microchip | 功能相似 | TFSOP-10 |
3.3V, 2.5Gbps ANY INPUT-to-LVPECL DUAL TRANSLATOR
|
||
SY55857LKI
|
Micrel | 功能相似 | MSOP-10 |
3.3V, 2.5Gbps ANY INPUT-to-LVPECL DUAL TRANSLATOR
|
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