Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DIP-16
External dimensions/width: 7.87 mm
External dimensions/packaging: DIP-16
Other/Packaging Methods: Tube
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Vishay Intertechnology | 类似代替 | DIP-16 |
Res Thick Film NET 1KΩ 2% 1.92W ±100ppm/℃ ISOL Molded 16Pin DIP Pin Thru-Hole Tube
|
||
MDP16031K00GE04
|
Vishay Semiconductor | 类似代替 | DIP-16 |
Res Thick Film NET 1KΩ 2% 1.92W ±100ppm/℃ ISOL Molded 16Pin DIP Pin Thru-Hole Tube
|
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