Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ICS85222AM-02
|
Integrated Device Technology | 功能相似 | SOIC |
1对2 , LVCMOS / LVTTL , HSTL TODIFFERENTIAL译者 1-TO-2, LVCMOS/LVTTL-TODIFFERENTIAL HSTL TRANSLATOR
|
||
ICS85222AM-02LF
|
Integrated Device Technology | 功能相似 | SOP |
1对2 , LVCMOS / LVTTL , HSTL TODIFFERENTIAL译者 1-TO-2, LVCMOS/LVTTL-TODIFFERENTIAL HSTL TRANSLATOR
|
||
ICS85222AM-02T
|
Integrated Device Technology | 功能相似 | SOIC |
1对2 , LVCMOS / LVTTL , HSTL TODIFFERENTIAL译者 1-TO-2, LVCMOS/LVTTL-TODIFFERENTIAL HSTL TRANSLATOR
|
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