Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
83905AGILFT
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
扇出缓冲器, 100MHZ, -40 至 85度 C
|
||
83905AGLF
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
低偏移, 1 : 6晶体用于─ LVCMOS / LVTTL扇出缓冲器 Low Skew, 1:6 Crystal-to- LVCMOS/LVTTL Fanout Buffer
|
||
83905AGLF
|
Renesas Electronics | 功能相似 |
低偏移, 1 : 6晶体用于─ LVCMOS / LVTTL扇出缓冲器 Low Skew, 1:6 Crystal-to- LVCMOS/LVTTL Fanout Buffer
|
|||
83905AGLFT
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
低偏移, 1 : 6晶体用于─ LVCMOS / LVTTL扇出缓冲器 Low Skew, 1:6 Crystal-to- LVCMOS/LVTTL Fanout Buffer
|
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