Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
H5TQ1G63EFR-H9C
|
SK Hynix | 功能相似 | TFBGA |
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin FBGA
|
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