Technical parameters/number of output interfaces: 409
Technical parameters/number of inputs: 519
Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: BGA-676
External dimensions/length: 27 mm
External dimensions/width: 27 mm
External dimensions/packaging: BGA-676
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC3SD1800A-4FG676I
|
Xilinx | 完全替代 | FBGA-676 |
XC3SD1800A-4FG676I 磨码
|
||
XC3SD1800A-4FGG676C
|
Xilinx | 完全替代 | FBGA-676 |
FPGA Spartan®-3A DSP Family 1.8M Gates 37440 Cells 667MHz 90nm Technology 1.2V 676Pin FBGA
|
||
XC3SD1800A-4FGG676I
|
Xilinx | 完全替代 | FBGA-676 |
FPGA Spartan-3A DSP Family 1.8M Gates 37440 Cells 667MHz 90nm Technology 1.2V 676Pin FBGA
|
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