Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Not Recommended
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W25Q64DWSFIG
|
Winbond Electronics | 功能相似 | SOIC-16 |
IC FLASH 64Mbit 104MHz 16SOIC
|
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