Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HYB25L256160AC-7.5
|
Infineon | 功能相似 | TFBGA |
BJAWBMSpecialty移动DRAM的-RAM BJAWBMSpecialty DRAMs Mobile-RAM
|
||
HYB25L256160AC-7.5
|
Qimonda | 功能相似 | TFBGA |
BJAWBMSpecialty移动DRAM的-RAM BJAWBMSpecialty DRAMs Mobile-RAM
|
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