Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: MSOP
External dimensions/packaging: MSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LTC4301IMS8#PBF
|
ADI | 功能相似 | 05-08-1660 |
LINEAR TECHNOLOGY LTC4301IMS8#PBF 芯片, 总线缓冲器, 热插拔, 2线式, 8MSOP
|
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