Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: TSOP1
External dimensions/length: 11.8 mm
External dimensions/width: 8 mm
External dimensions/packaging: TSOP1
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M28256-15NS1T
|
ST Microelectronics | 功能相似 | TSOP1 |
256千位32Kb的X8并行EEPROM与软件数据保护 256 Kbit 32Kb x8 Parallel EEPROM with Software Data Protection
|
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