Technical parameters/access time: 90.0 ns
Technical parameters/memory capacity: 64000000 B
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TFBGA-56
External dimensions/packaging: TFBGA-56
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
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