Encapsulation parameters/Encapsulation: PLCC
External dimensions/packaging: PLCC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG529CWN+
|
Maxim Integrated | 功能相似 | SOIC-18 |
MAXIM INTEGRATED PRODUCTS DG529CWN+ 芯片, 模拟多路复用器, 双路, 4:1, WSOIC-18
|
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