Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HCT4060N
|
NXP | 功能相似 | DIP |
NXP 74HCT4060N 芯片, 74HCT CMOS逻辑器件
|
||
74HCT4060N
|
Philips | 功能相似 | DIP |
NXP 74HCT4060N 芯片, 74HCT CMOS逻辑器件
|
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