Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: QSOP
External dimensions/packaging: QSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74FCT827CTQ
|
Integrated Device Technology | 功能相似 | QSOP |
10Bit Non-Invrtng Buffer
|
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