Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UC5601DWP
|
TI | 功能相似 | SOIC-28 |
SCSI主动终结者 SCSI Active Terminator
|
||
|
|
Unitrode | 功能相似 | SOP |
SCSI主动终结者 SCSI Active Terminator
|
||
UC5601DWP
|
Internix | 功能相似 |
SCSI主动终结者 SCSI Active Terminator
|
|||
UC5601DWPTR
|
TI | 功能相似 | SOIC-28 |
SCSI主动终结者 SCSI Active Terminator
|
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