Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2855
|
Visual Communications Company | 功能相似 |
Standard SRAM, 8KX8, 120ns, CMOS, CDIP28,
|
|||
2855
|
Broadcom | 功能相似 |
Standard SRAM, 8KX8, 120ns, CMOS, CDIP28,
|
|||
2855
|
AVAGO Technologies | 功能相似 |
Standard SRAM, 8KX8, 120ns, CMOS, CDIP28,
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review