Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LCX16373MTD
|
Fairchild | 功能相似 | TSSOP-48 |
FAIRCHILD SEMICONDUCTOR 74LCX16373MTD 芯片, 16位锁存器
|
||
74LCX16373MTDX
|
Fairchild | 功能相似 | TSSOP-48 |
FAIRCHILD SEMICONDUCTOR 74LCX16373MTDX 芯片, D型锁存器, 透明, 三态, TSSOP-48
|
||
74LCX16373MTDX
|
Fairchild | 功能相似 | TSSOP-48 |
FAIRCHILD SEMICONDUCTOR 74LCX16373MTDX 芯片, D型锁存器, 透明, 三态, TSSOP-48
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review