Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
552G-02ILNT
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
低偏移2输入多路复用器和1至8时钟缓冲器工业级温度 LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER Industrial temperature
|
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