Encapsulation parameters/installation method: Screw
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: 2-11D1B
External dimensions/packaging: 2-11D1B
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TIM5964-16SL
|
Toshiba | 功能相似 | 2-16G1B |
Trans JFET 15V 14A 3Pin 2-16G1B
|
||
|
|
Toshiba | 类似代替 | 2-11D1B |
Trans FET 15V 7A GaAs 3Pin 2-11D1B
|
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