Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 456
Encapsulation parameters/Encapsulation: FBGA-456
External dimensions/packaging: FBGA-456
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Not Recommended
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC2VP2-5FG456I
|
Xilinx | 类似代替 | BBGA-456 |
FPGA Virtex-II Pro Family 3168 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 456Pin F-BGA
|
||
XC2VP2-5FGG456C
|
Xilinx | 类似代替 | BBGA-456 |
FPGA Virtex-II Pro Family 3168 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 456Pin F-BGA
|
||
XC2VP2-5FGG456I
|
Xilinx | 类似代替 | BBGA-456 |
FPGA Virtex-II Pro Family 3168 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 456Pin F-BGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review