Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
QS32245PAG
|
Integrated Device Technology | 功能相似 | TSSOP-20 |
数字总线开关 IC BUF WITH RESISTOR QSW
|
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