Technical parameters/number of circuits: 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 10
Encapsulation parameters/Encapsulation: CPAK
External dimensions/packaging: CPAK
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Rail
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM211P
|
TI | 类似代替 | PDIP-8 |
TEXAS INSTRUMENTS LM211P 模拟比较器, 单路, 高速, 1, 115 ns, 3.5V 至 30V, DIP, 8 引脚
|
||
LM211P
|
TI | 类似代替 | PDIP-8 |
TEXAS INSTRUMENTS LM211P 模拟比较器, 单路, 高速, 1, 115 ns, 3.5V 至 30V, DIP, 8 引脚
|
||
LM211P
|
Rochester | 类似代替 | TSSOP |
TEXAS INSTRUMENTS LM211P 模拟比较器, 单路, 高速, 1, 115 ns, 3.5V 至 30V, DIP, 8 引脚
|
||
LM211PE4
|
TI | 类似代替 | DIP-8 |
与选通差动比较仪 DIFFERENTIAL COMPARATORS WITH STROBES
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