Encapsulation parameters/Encapsulation: Chip/Wafer
External dimensions/packaging: Chip/Wafer
Other/Status: Standard
Other/RoHS: Compliant
Other/Type: Hyperabrupt
Other/CT Typ. 1: 4.9 pF
Other/CT Test Condition 1: 4 V
Other/CT Test Condition 2: 20 V
Other/Capacity Ratio 1: 4.2
Other/Min VB IR=10 uA: 22 V
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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