Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM26LS30DM
|
AMD | 功能相似 | DIP |
Line Driver, 4 Func, 4 Driver, BIPolar, CDIP16, HERMETIC SEALED, DIP-16
|
||
|
|
AMD | 功能相似 | DIP |
Line Driver, 4 Func, 4 Driver, BIPolar, CDIP16, CERAMIC, DIP-16
|
||
|
|
Rochester | 功能相似 | DIP |
Dual differential/quad single-ended line drivers
|
||
AM26LS30PC
|
AMD | 功能相似 | DIP |
Dual differential/quad single-ended line drivers
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review