Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Philips | 功能相似 | SOP |
八路缓冲器三态 Octal buffers 3-State
|
||
N74F244D
|
NXP | 功能相似 | SOIC |
八路缓冲器三态 Octal buffers 3-State
|
||
SN74F240N
|
NXP | 功能相似 | DIP |
八路缓冲器/驱动器,具有三态输出 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
|
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