Package parameters/number of pins: 672
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC4VFX40-10FF672I
|
Xilinx | 功能相似 | BBGA-672 |
XC4VFX40 10FF672I 磨码
|
||
XC4VFX40-11FFG672C
|
Xilinx | 功能相似 | FCBGA-672 |
XC4VFX40 11FFG672C 磨码
|
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