Technical parameters/minimum current amplification factor (hFE): 100
Technical parameters/Maximum current amplification factor (hFE): 300
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOT-89
External dimensions/width: 2.6 mm
External dimensions/packaging: SOT-89
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PBSS5350X@135
|
NXP | 功能相似 | Surface Mount |
PBSS5350X@135
|
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