Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: LCC
External dimensions/length: 8.90 mm
External dimensions/width: 8.90 mm
External dimensions/packaging: LCC
External dimensions/thickness: 1.52 mm
Other/Product Lifecycle: Obsolete
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY74FCT273TQCT
|
TI | 功能相似 | SSOP-20 |
8位寄存器 8-Bit Register
|
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