Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MIC3172YM
|
Micrel | 类似代替 | SOIC-8 |
Micrel Inc ### 开关电压调节器,Microchip
|
||
MIC3172YM
|
Microchip | 类似代替 | SOIC-8 |
Micrel Inc ### 开关电压调节器,Microchip
|
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