Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MIC2178BWM
|
Micrel | 功能相似 | SOIC-20 |
Conv DC-DC 4.5V to 16.5V Step Down Single-Out 1.25V to 16.5V 2.5A 20Pin SOIC W
|
||
MIC2178BWM
|
Microchip | 功能相似 | SOIC-20 |
Conv DC-DC 4.5V to 16.5V Step Down Single-Out 1.25V to 16.5V 2.5A 20Pin SOIC W
|
||
MIC2178YWM
|
Micrel | 功能相似 | SOIC-20 |
Conv DC-DC Single Step Down 4.5V to 16.5V 20Pin SOIC W
|
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