Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC10EL31DG
|
ON Semiconductor | 功能相似 | SOIC-8 |
ON SEMICONDUCTOR MC10EL31DG 触发器, 设置和复位, 差分, ECL, 正沿, D, 475 ps, 2.8 GHz, 50 mA, SOIC, 8 引脚
|
||
MC10EL51DR2G
|
ON Semiconductor | 完全替代 | SOIC-8 |
5V ECL差分时钟D触发器 5V ECL Differential Clock D Flip-Flop
|
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