Technical parameters/RAM size: 12 KB
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 80
Encapsulation parameters/Encapsulation: LQFP-80
External dimensions/packaging: LQFP-80
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MB96F326RSBPMC-GSE2
|
Fujitsu | 功能相似 | LQFP-80 |
MCU 16Bit MB96320 F2MC-16FX CISC 288KB Flash 3.3V/5V 80Pin LQFP
|
||
MB96F326RSBPMC-GSE2
|
Spansion | 功能相似 | LFQFP |
MCU 16Bit MB96320 F2MC-16FX CISC 288KB Flash 3.3V/5V 80Pin LQFP
|
||
MB96F326RSBPMC-GSE2
|
Cypress Semiconductor | 功能相似 | LQFP-80 |
MCU 16Bit MB96320 F2MC-16FX CISC 288KB Flash 3.3V/5V 80Pin LQFP
|
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