Technical parameters/number of circuits: 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: MSOP
External dimensions/packaging: MSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPA701DGN
|
TI | 功能相似 | PowerPad-MSOP-8 |
TEXAS INSTRUMENTS TPA701DGN. 音频功率放大器, AB, 1通道, 700 mW, 2.5V 至 5.5V, MSOP, 8 引脚
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TPA701DGN
|
Rochester | 功能相似 |
TEXAS INSTRUMENTS TPA701DGN. 音频功率放大器, AB, 1通道, 700 mW, 2.5V 至 5.5V, MSOP, 8 引脚
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