Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 9
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM4667ITL
|
TI | 功能相似 | FBGA |
滤波的高效1.3W开关音频放大器 Filterless High Efficiency 1.3W Switching Audio Amplifier
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||
LM4667ITLX
|
National Semiconductor | 功能相似 | uSMD |
滤波的高效1.3W开关音频放大器 Filterless High Efficiency 1.3W Switching Audio Amplifier
|
||
TPA2010D1YZF
|
TI | 功能相似 | BGA-9 |
2.5W单声道无滤波器D类音频功率放大器 2.5-W MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER
|
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