Technical parameters/accuracy: ±2 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM35DM/NOPB
|
TI | 功能相似 | SOIC-8 |
TEXAS INSTRUMENTS LM35DM/NOPB 温度传感器芯片, 电压, ± 0.4°C, 0 °C, +100 °C, SOIC, 8 引脚
|
||
LM35DM/NOPB
|
TI | 功能相似 | SOIC-8 |
TEXAS INSTRUMENTS LM35DM/NOPB 温度传感器芯片, 电压, ± 0.4°C, 0 °C, +100 °C, SOIC, 8 引脚
|
||
LM35DM/NOPB
|
National Semiconductor | 功能相似 | SOIC-8 |
TEXAS INSTRUMENTS LM35DM/NOPB 温度传感器芯片, 电压, ± 0.4°C, 0 °C, +100 °C, SOIC, 8 引脚
|
||
LM35DMX/NOPB
|
National Semiconductor | 功能相似 | SOIC-8 |
TEXAS INSTRUMENTS LM35DMX/NOPB 温度传感器芯片, 电压, ± 1.5°C, 0 °C, SOIC, 8 引脚
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review