Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: uSMD-16
External dimensions/packaging: uSMD-16
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM3554TMX/NOPB
|
TI | 类似代替 | WFBGA-16 |
具有 1.2A 双路高侧 LED 驱动器和 I2C 兼容接口的同步升压转换器 16-DSBGA -30 to 85
|
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