Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72V273L10PFI
|
Integrated Device Technology | 功能相似 | LQFP-80 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 18/32K x 9 80Pin TQFP
|
||
|
|
Renesas Electronics | 功能相似 | LQFP-80 |
FIFO, 16KX18, 5ns, Synchronous, CMOS, PQFP80, PLASTIC, TQFP-80
|
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