Technical parameters/RAM size: 28262.4 b
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.71V ~ 3.465V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: LFBGA-256
External dimensions/length: 14 mm
External dimensions/width: 14 mm
External dimensions/height: 0.65 mm
External dimensions/packaging: LFBGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A991.d
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LCMXO2280C-4B256I
|
Lattice Semiconductor | 完全替代 | LFBGA-256 |
FPGA - 现场可编程门阵列 2280 LUTs 211 I/O 1.8/2.5/3.3V -4 SPD
|
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