Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOP
External dimensions/length: 10.3 mm
External dimensions/width: 7.5 mm
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MCL908QY2CDWE
|
NXP | 功能相似 | SOIC-16 |
IC MCU 8Bit 1.5KB FLASH 16SOIC
|
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