Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71V321L25TFGI
|
Integrated Device Technology | 功能相似 | TQFP-64 |
SRAM Chip Async Dual 3.3V 16Kbit 2K x 8 25ns 64Pin STQFP Tray
|
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